日韩一级片,高清免费av,白白色免费视频,二级片在线观看

全生物降解改性粒子TPEE的使用特點(diǎn)

全生物降解改性粒子TPEE的使用特點(diǎn)

網(wǎng)址:http://www.fs-sjg.com 手機(jī)頁面二維碼 2023-12-25 17:17:15    

真包膠:TPEE與塑料、金屬等材料通過化學(xué)作用在兩種材料的鍵合界面形成牢固的焊接或鍵合作用,如分子滲透、極性基團(tuán)的反應(yīng)性連接和鍵合或類似的氫鍵,而沒有任何機(jī)械和物理作用。無需粘合劑,可通過注塑直接與金屬結(jié)合。

True package adhesive: TPEE forms a strong welding or bonding effect with plastic, metal and other materials through chemical reactions at the bonding interface of the two materials, such as molecular penetration, reactive bonding of polar groups, and bonding or similar hydrogen bonding, without any mechanical or physical interaction. No adhesive required, can be directly bonded to metal through injection molding.

在這種加工方法中,TPEE和金屬零件一般是整體包膠的,TPE的硬度盡可能高(70~80A及以上),這樣可以達(dá)到一定的包膠效果,因?yàn)門PE和金屬的包膠不具有真正意義上的附著力(化學(xué)和分子水平),金屬完全被TPE的強(qiáng)度所包膠。此外,金屬零件表面有凹槽和孔(如螺母和刀柄)。

In this processing method, TPEE and metal parts are generally encapsulated as a whole, and the hardness of TPE is as high as possible (70-80A and above), which can achieve a certain encapsulation effect because TPE and metal encapsulation do not have true adhesion (chemical and molecular level), and the metal is completely encapsulated by the strength of TPE. In addition, metal parts have grooves and holes on the surface (such as nuts and tool holders).

2.假包膠:TPEE與硬質(zhì)材料(塑料、金屬或其他材料)純靠孔洞、凹槽等卡扣方式進(jìn)行物理機(jī)械結(jié)合,而不是單純依靠兩種材料的化學(xué)結(jié)合。兩種材料的結(jié)合面沒有分子水平的直接滲透,也沒有極性基團(tuán)或類似氫鍵的反應(yīng)鏈接鍵(范德華力)。用粘合劑粘合。

2. False packaging adhesive: TPEE and hard materials (plastic, metal, or other materials) rely solely on physical and mechanical bonding methods such as holes and grooves, rather than relying solely on chemical bonding between the two materials. The bonding surface of the two materials does not have direct penetration at the molecular level, nor does it have polar groups or reaction linking bonds similar to hydrogen bonds (van der Waals forces). Glue with adhesive.

20181025024124686.jpg

有時(shí)候?qū)τ谝恍┨厥猱a(chǎn)品,橡膠只是部分覆蓋了金屬零件的相應(yīng)位置,不利于TPEE與金屬零件的牢固結(jié)合。在需要涂覆的金屬表面涂覆一層粘合劑是一種常見的想法。但實(shí)際上,由于TPEE與橡膠的成型工藝不同,對(duì)橡膠零件與金屬零件的粘接牢固度有重要影響。膠粘劑類型的選擇對(duì)于這類金屬制品的涂裝關(guān)重要。

Sometimes for some special products, rubber only partially covers the corresponding positions of the metal parts, which is not conducive to the strong bonding between TPEE and metal parts. It is a common idea to apply a layer of adhesive on the metal surface that needs to be coated. However, in reality, due to the different molding processes between TPEE and rubber, it has a significant impact on the adhesion strength between rubber parts and metal parts. The selection of adhesive type is crucial for the coating of such metal products.

3.整體包膠

3. Overall encapsulation

整體包膠相當(dāng)于注塑一個(gè)TPEE塑料件,其中硬件產(chǎn)品是包膠的,沒有化學(xué)鍵合,所以包膠還是可行的。一般硬度較高的TPEE,硬度在80A以上的都可以包膠,但是包膠的五金件要整體鍍膜,如果只鍍膜一部分很難實(shí)現(xiàn)。

The overall encapsulation is equivalent to injecting a TPEE plastic part, and the hardware product is encapsulated without chemical bonding, so encapsulation is still feasible. Generally, TPEE with higher hardness can be coated with adhesive if the hardness is above 80A. However, the hardware components coated with adhesive need to be coated as a whole, and it is difficult to achieve this if only a part of the coating is coated.

4.局部包膠

4. Local encapsulation

部分灌封,硬度偏軟,強(qiáng)度不足,不易粘接,通過五金的孔洞處理,可以加強(qiáng)TPEE與五金的物理機(jī)械結(jié)合,從而提高灌封牢固度。這種包膠是很多情況下硫化橡膠零件包膠五金件,但是橡膠是硫化的。如果使用注射成型,很難部分包膠TPEE和硬件。如果五金件穿孔,會(huì)在五金件產(chǎn)品中注入TPEE膠,這可能會(huì)提高包膠牢固度。另一個(gè)客戶嘗試預(yù)粘五金,然后注塑,效果不好。

Partial sealing has a soft hardness and insufficient strength, making it difficult to adhere. By treating the holes in the hardware, the physical and mechanical bonding between TPEE and hardware can be strengthened, thereby improving the sealing firmness. This type of encapsulation is often used to encapsulate vulcanized rubber parts and hardware, but rubber is vulcanized. If injection molding is used, it is difficult to partially encapsulate TPEE and hardware. If the hardware components are perforated, TPEE adhesive will be injected into the hardware products, which may improve the firmness of the packaging adhesive. Another customer tried pre bonding hardware and then injection molding, but the effect was not good.

感謝您的閱讀,此文的文章來源:可降解顆粒更多的內(nèi)容和問題請(qǐng)點(diǎn)擊:http://www.fs-sjg.com我們會(huì)繼續(xù)努力的為您提供服務(wù),感謝您的支持!

Thank you for reading. The source of this article is biodegradable particles. For more information and questions, please click: http://www.fs-sjg.com We will continue to work hard to provide you with services. Thank you for your support!